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4 Inch 4H-SiC Substrate P-level SI 500.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm For Power Microwave

Shanghai GaNova Electronic Information Co., Ltd.
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4 Inch 4H-SiC Substrate P-level SI 500.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm For Power Microwave

Brand Name : GaNova

Model Number : JDCD03-002-002

Certification : UKAS/ISO9001:2015

Place of Origin : Suzhou China

Payment Terms : T/T

Delivery Time : 3-4 week days

Packaging Details : Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.

Product Name : Sic Epitaxial Wafer

Diameter : 100.0mm+0.0/-0.5mm

Surface orientation : {0001}±0.2°

Length of main reference edge : 32.5 mm ± 2.0 mm

The edge of the wafer : angle of chamfer

thickness : 500.0±25.0μm

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JDCD03-002-002 4inch 4H-SiC substrate P-level SI 500.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm for power and microwave devices

Overview

SiC is used for the fabrication of very high-voltage and high-power devices such as diodes, power transistors, and high power microwave devices. Compared to conventional Si-devices, SiC-based power devices have faster switching speed higher voltages, lower parasitic resistances, smaller size, less cooling required due to high-temperature capability.

4inch 4H-SiC Semi-insulating substrate

Product performance P level D level
Crystal form 4H
Polytypic Not allow Area≤5%
Micropipe Densitya ≤0.3/cm2 ≤5/cm2
Six square empty Not allow Area≤5%
Hexagon surface hybrid crystal Not allow Area≤5%
wrappage a Area≤0.05% N/A
Resistivity ≥1E9Ω·cm ≥1E5Ω·cm

(0004) XRDHalf height width of rocking curve (FWHM)

≤45Arcsecond

N/A

Diameter 100.0mm+0.0/-0.5mm
Surface orientation {0001}±0.2°
Length of main reference edge

32.5 mm ± 2.0 mm

Length of secondary reference edge 18.0 mm ± 2.0 mm
Main reference plane orientation parallel<11-20> ± 5.0˚
Secondary reference plane orientation 90 ° clockwise to the main reference plane ˚ ± 5.0 ˚, Si face up
surface preparation C-Face: Mirror Polishing, Si-Face: Chemical Mechanical Polishing (CMP)
The edge of the wafer angle of chamfer

Surface roughness(5μm×5μm)

Si face Ra<0.2 nm

thickness

500.0±25.0μm

LTV(10mm×10mm)a

≤2µm

≤3µm

TTVa

≤6µm

≤10µm

Bowa

≤15µm

≤30µm

Warpa

≤25µm

≤45µm

Broken edge / gap Collapse edges of a length and a width of 0.5mm are not allowed ≤2 and each length and width of 1.0mm
scratcha ≤4,And the total length is 0.5 times the diameter ≤5 ,And the total length is 1.5 times the diameter
flaw not allow
pollution not allow
Edge removal

3mm

Remark: 3mm edge exclusion is used for the items marked with a.

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.


Product Tags:

P-level 4H-SiC substrate

      

Microwave 4H-SiC substrate

      

4inch 4H-SiC substrate

      
Wholesale 4 Inch 4H-SiC Substrate P-level SI 500.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm For Power Microwave from china suppliers

4 Inch 4H-SiC Substrate P-level SI 500.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm For Power Microwave Images

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